节点文献
耐化学镍金的高频覆盖膜的开发与表征
Development and characterization of a high-frequency coverlay resistant to ENIG
【摘要】 本文合成含羧基侧基的可溶聚酰亚胺树脂,并考察树脂的理论酸值对覆盖膜溢胶量、耐化学渗金、介电性能的影响。研究结果表明,随着树脂理论酸值增大,其溢胶量逐渐降低,其在空气氛围固化制备得到的FPC的耐化学渗金性能越好,而其介电性能逐渐变差。当树脂的当理论酸值处于27.2 KOH mg/g~36.2 KOH mg/g范围内时,具备良好的综合性能。进一步测试表明,该覆盖膜性能均满足IPC-4203/21要求。
【Abstract】 This study synthesized soluble polyimide resins containing carboxyl side groups and investigated the effects of the theoretical acid value on the resin flow,resistance to chemical gold penetration,and dielectric properties of the cover film.The results indicate that as the theoretical acid value of the resin increases,the resin flow gradually decreases,the resistance to chemical gold penetration of the FPC cured in an air atmosphere improves,while the dielectric properties gradually deteriorate.The resin demonstrates balanced overall performance when its theoretical acid value falls within the range of 27.2 KOH mg/g to 36.2 KOH mg/g.Further testing confirms that the cover film meets all the requirements specified in IPC-4203/21.
【Key words】 High-Frequency; Coverlay; Dielectric Properties; Air-Atmosphere Curing; Polyimide Resin;
- 【文献出处】 印制电路信息 ,Printed Circuit Information , 编辑部邮箱 ,2026年S1期
- 【分类号】TN41
- 【下载频次】2