【摘要】 针对目前高纯铜制备方法（再生铜冶炼法和真空蒸馏法）工艺复杂、成本高，且难以大规模生产等问题，本文沿用课题组提出的在阴极板包裹滤网的方法制备高纯铜，利用COMSOL Multiphysics软件进行铜电解精炼过程的数值模拟，并根据模拟结果进行了验证试验。模拟结果表明：在阴极板上包裹滤网布后，电解槽内Cu²⁺浓度整体分布较均匀，槽底浓度略高；铜的耗尽区不再局限于阴极表面，而是扩展到滤网与阴极板之间的整个区域；滤网与阴极板之间不受强制对流的影响，在电解液密度梯度的驱动下形成沿阴极板向上沿滤网内侧向下的顺时针循环；阴极板表面电流密度差异较大，底部相较于顶部电流密度提升了156%，在电流密度186 A/m²下电解阴极铜表面出现树枝状结瘤，合适的电流密度为93 A/m²。验证试验表明：在滤网孔径1μm、电流密度93 A/m²的条件下进行常规电解，可以大幅提高阴极铜的纯度；阴极铜板表面顶部区域的杂质粒子浓度低于底部（Mo元素除外）；将所制备铜阴极板顶部区域的成分结果与《高纯铜》国标对比，只有Ag元素含量高于国标上限，纯度达到99.999 583 56%。未来可尝试采用脉冲电流或周期反向电流电解，或者添加平整剂的方法获得更为平坦的沉积层；可预先在电解液中添加适量的盐酸除Ag，从而进一步提高阴极铜的纯度。本研究结果可为大规模生产高纯铜提供理论及技术参考。更多还原

【Abstract】 Aiming at the problems of complex process, high cost and difficulty in large-scale production of existing high-purity copper preparation methods（recycled copper smelting process and vacuum distillation process）, this paper adopts the method of wrapping filter screen on cathode plates proposed by the research group to prepare highpurity copper. Numerical simulation of the copper electrolytic refining process is carried out using COMSOL Multiphysics software, and verification experiments are conducted based on the simulation results. The simulation results show that after wrapping filter screen cloth on the cathode plate, the overall distribution of Cu²⁺ concentration in the electrolytic cell is relatively uniform, with a slightly higher concentration at the tank bottom; the copper depletion zone is no longer limited to the cathode surface, but extends to the entire area between the filter screen and the cathode plate; the region between the filter screen and the cathode plate is not affected by forced convection, and a clockwise circulation upward along the cathode plate and downward along the inner side of the filter screen is formed driven by the density gradient of the electrolyte; the current density on the cathode plate surface varies greatly, with the current density at the bottom increased by 156% compared with that at the top. Dendritic nodules appear on the surface of electrolytic cathode copper at a current density of 186 A/m², and the appropriate current density is 93 A/m². The verification experiments show that conventional electrolysis under the conditions of 1 μm filter screen pore size and 93 A/m² current density can significantly improve the purity of cathode copper; the concentration of impurity particles in the top area of the cathode copper plate surface is lower than that in the bottom area（except for Mo element）; by comparing the composition results of the top area of the prepared cathode copper plate with the national standard for High-Purity Copper, only the Ag element content is higher than the upper limit of the national standard, and the purity reaches 99. 99958356%. In the future, pulse current or periodic reverse current electrolysis, or the addition of leveling agents can be attempted to obtain a flatter deposition layer; an appropriate amount of hydrochloric acid can be added to the electrolyte in advance to remove Ag, so as to further improve the purity of cathode copper. The research results can provide theoretical and technical references for the large-scale production of high-purity copper.更多还原