【摘要】 设计了一种能在中低温度下实现完全固化及损伤自修复的含有动态S—S环氧类玻璃高分子(Vitrimer)材料。实验表明：该聚合物材料拥有良好的热力学性能(5%热分解温度为310℃)、快速应力松弛行为(τ=40 s)和优异的疏水特性(接触角为92°);在温度循环后，材料表现出良好的稳定性，在70℃实现损伤自愈且在DTT/DMF试剂中能够进行化学回收。合成的聚合物材料具有优异的自愈性能和可拆解特性，可实现高价值电子器件的回收利用。更多还原

【Abstract】 We have designed a dynamic disulfide(S—S) epoxy Vitrimer material that allows the polymer to be fully cured and self-heal from damage at low to medium temperatures, while being recyclable for high-value electronic devices. Experiments show that the material has good thermodynamic stability(5% thermal decomposition temperature of 310 ℃), fast stress relaxation behavior(τ=40 s) and excellent hydrophobicity(contact angle of 92°). After temperature cycling, the material shows good stability, self-heals from damage at 70 ℃ and achieve chemical recovery in DTT/DMF solution, with excellent self-healing and disassembly properties.更多还原