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磺胺胍对含胺预聚物型热熔邻苯二甲腈树脂固化行为的促进作用研究

Study on the accelerating effect of sulfaguanidine on the curing behavior of hot melt prepolymeric phthalonitrile resin containing amine

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【作者】 陈良钦; 黄海泓; 吴霄; 卢世龙; 张孝阿; 王成忠; 张军营;

【Author】 Chen Liangqin;Huang Haihong;Wu Xiao;Lu Shilong;Zhang Xiaoa;Wang Chengzhong;Zhang Junying;Key Laboratory of Carbon Fiber and Functional Polymers of Ministry of Education,College of Materials Science and Engineering,Beijing University of Chemical Technology;AVIC Research Institute for Special Structures of Aeronautical Composites;

【通讯作者】 张孝阿;

【机构】 北京化工大学碳纤维及功能高分子教育部重点实验室,材料科学与工程学院; 中国航空工业集团公司济南特种结构研究所;

【摘要】 为提高含胺预聚物型热熔邻苯二甲腈树脂(PNA)的固化效率,探究磺胺胍对PNA固化行为的促进作用。本研究通过熔融共混法制备了不同磺胺胍含量(1~7份)的PNAS树脂体系,并对它们的放热行为进行分析,进一步探讨PNA和PNAS-5的固化动力学、热性能和粘接性能。研究结果表明:磺胺胍显著降低了PNA的固化温度与活化能,随其用量增加,固化放热峰由双峰逐渐合并为单峰;当磺胺胍用量为5份(PNAS-5)时,固化峰值温度由PNA的330℃降至260℃,主要固化温区从300℃以上移至230~300℃。动力学分析显示,PNAS-5的平均活化能为67.10 kJ/mol,较PNA(98.45 kJ/mol)降低约31.8%,且低转化率下活化能更低,更利于低温固化。在200℃/3 h+220℃/3 h固化条件下,PNAS-5的25℃拉伸剪切强度达18.2 MPa,较PNA提高61%。磺胺胍未损害体系的高热稳定性,PNA与PNAS-5的初始分解温度(T5%)分别为479与481℃,800℃残碳率均高于74%;但因磺胺胍柔性结构的引入,PNAS-5的玻璃化转变温度(Tg)降低42℃,致其高温粘接强度略有下降,体现了力学增强与热机械性能间的平衡。综合研究表明,磺胺胍可有效地促进含胺邻苯二甲腈树脂的低温高效固化,兼具优良热稳定性与常温粘接性能。

【Abstract】 To improve the curing efficiency of hot melt prepolymeric phthalonitrile resin containing amine(PNA),the accelerating effect of sulfaguanidine on the curing behavior of PNA was investigated. PNAS resin systems with different sulfaguanidine contents(1-7 phr) by melt blending method were prepared in this study,and their exothermic behavior was analyzed to further explore the curing kinetics,thermal properties,and bonding properties of PNA and PNAS-5.The research results showed that sulfaguanidine significantly reduced the curing temperature and activation energy of PNA.As the dosage increased,the exothermic peak of curing gradually merged from double peaks to a single peak. When the dosage of sulfaguanidine was 5 phr(PNAS-5),the curing peak temperature decreased from 330 ℃ of PNA to 260 ℃,and the main curing temperature zone shifted from above 300 ℃ to 230-300 ℃.Dynamics analysis showed that the average activation energy of PNAS-5 was 67.10 kJ/mol,which was about 31.8% lower than that of PNA(98.45 kJ/mol),and the activation energy was lower at low conversion rates,which was more conducive to low-temperature curing.Under the curing condition of 200 ℃/3 h+220 ℃/3 h,the tensile shear strength of PNAS-5 at 25 ℃ reached 18.2 MPa,which was 61% higher than that of PNA.Sulfaguanidine did not damage the high thermal stability of the system.The initial decomposition temperatures(T5%) of PNA and PNAS-5 were 479 ℃ and 481 ℃,respectively,and the residual carbon rates at 800 ℃ were all higher than 74%. However,due to the introduction of sulfaguanidine flexible structure,the glass transition temperature(Tg) of PNAS-5 decreased by 42 ℃,resulting in a slight decrease in its high-temperature bonding strength,reflecting the balance between mechanical enhancement and thermomechanical properties.Comprehensive research had shown that sulfaguanidine could effectively promote the low-temperature and efficient curing of phthalonitrile resin containing amine,with excellent thermal stability and room temperature bonding properties.

【基金】 航空工业特种所-北京化工大学异质多界面电磁功能结构胶接及封装联合实验室应用基础研究课题(637-2022-70-F-092)
  • 【文献出处】 中国胶粘剂 ,China Adhesives , 编辑部邮箱 ,2026年04期
  • 【分类号】TQ430.1
  • 【下载频次】8
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