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低共熔溶剂中SiC颗粒对Ni电沉积行为的影响
Influence of SiC particles on nickel electrodeposition behavior in deep eutectic solvents
【摘要】 在氯化胆碱(ChCl)-乙二醇(EG)体系的镀液中,利用复合电沉积技术制备了Ni-SiC复合镀层。通过红外光谱(IR)和循环伏安(CV)进行分子结构分析、电化学反应机理研究,借助SEM观察镀层的微观结构,并利用XRD分析其物相组成。结果表明:CE、CE-NiCl2和CE-NiCl2-SiC体系中存在游离胆碱结构,SiC加入对有机结构无显著影响。SiC加入使还原峰正移,峰值电流略有下降,Ni2+在该体系的电沉积过程为不可逆过程,受扩散-动力学混合控制,成核方式则从三维瞬时成核向三维连续成核转变。SiC颗粒的加入显著细化了镀层晶粒。
【Abstract】 In the choline chloride(ChCl)-ethylene glycol(EG) based electrolyte, Ni-SiC composite coatings were fabricated via composite electrodeposition. The coatings were systematically characterized by infrared spectroscopy(IR) for molecular structure analysis, cyclic voltammetry(CV) for electrochemical reaction mechanism investigation, SEM for microstructure observation, and XRD for phase composition determination. The results demonstrated that free choline structures exist in the CE, CE-NiCl2, and CE-NiCl2-SiC systems, with SiC addition showing negligible influence on the organic structure. The incorporation of SiC particles caused a positive shift in the reduction potential along with a slight decrease in peak current. The electrodeposition process of Ni2+ was identified as irreversible and controlled by mixed diffusion-kinetics, with the nucleation mechanism transitioning from three-dimensional instantaneous to progressive nucleation. Notably, the addition of SiC particles significantly refined the coating grain structure.
【Key words】 nickel-silicon carbide alloy; electrodeposition; deep eutectic solvent;
- 【文献出处】 电镀与精饰 ,Plating and Finishing , 编辑部邮箱 ,2026年06期
- 【分类号】TQ153
- 【下载频次】9