【摘要】 陶瓷基板以其高导热性、高绝缘性、高机械强度、高化学稳定性和低热膨胀系数等优良特性，成为目前电子封装领域研究的热点。铜电沉积是陶瓷基板中实现电气连接的主要方式，厚铜电沉积质量直接影响到热量传递和信号传输稳定性。有机添加剂通过分子特有官能团可在阴极表面电流密度峰值区域选择性吸附，形成动态电流分布调节机制，有效改善镀液在微观尺度的整平能力。为量化评估添加剂作用效果，本研究采用哈林槽实验研究了3种不同种类添加剂对金属铜镀层生长的影响及对电沉积表面的调控效果，并通过表面粗糙度和铜层厚度均匀性评估了添加剂作用下镀液的调控能力，实现厚度差值±2μm的陶瓷基板120μm厚铜均匀电镀，铜层表面粗糙度仅为0.014μm。更多还原

【Abstract】 Due to the excellent properties including high thermal conductivity, superior insulation performance, robust mechanical strength, outstanding chemical stability and low coefficient of thermal expansion, ceramic substrates have become a hot research in the field of electronic packaging research. Electroplating copper is the primary method for achieving electrical interconnects on ceramic substrates. Thermal management efficiency and signal transmission stability in high-density packaging applications could be directly affected by the quality of thick copper. Organic additives play a pivotal role in regulating the electrodeposition process through specific functional group adsorption at high current density regions on the cathode surface. This adsorption mechanism effectively modulates current distribution across the electrode interface while enhances micro-level leveling capability of the plating solution. To quantify the effects of additives performance, Haring cell experiments were used to investigate three types of additives on the growth of copper plating layer and surface regulation efficacy. Meanwhile, surface roughness and copper layer thickness uniformity were employed to analyze the regulating performance of the formulas with additives, thereby resulting in plating uniformity with thickness variation controlled of ±2 μm across 120 μm thick deposits and surfaces roughness value of 0.014 μm on ceramic substrates.更多还原