【摘要】 随着芯片集成度的不断提升与封装尺寸的持续缩小，摩尔定律逐渐逼近物理极限。为延续摩尔定律的发展，传统的二维平面封装已逐步向三维立体封装演进。然而，由于三维（3D）封装的复杂性和异构性，且封装结构内部不同材料的热膨胀系数（CTE）存在差异，在温度循环、工作高温及环境应力的共同作用下，界面处易产生热应力集中，进而引发焊点疲劳断裂、硅通孔（TSV）侧壁开裂及层间剥离等力学失效问题。在此背景下，3D封装力学仿真技术已成为解决此类问题的重要手段，开展相关研究的必要性与紧迫性日益突出。系统梳理集成电路3D封装力学仿真技术的现有研究方法与最新进展，明确3D封装典型力学失效问题及对应的力学本构与失效准则，分类阐述有限元法（FEM）、边界元法（BEM） 2类核心仿真方法的基本原理、适用场景及技术局限，进而分析基于FEM和BEM的多物理场耦合仿真方法的技术演进逻辑及其在复杂失效场景中的应用价值，总结当前技术体系的核心瓶颈，并展望其未来发展前景。更多还原

【Abstract】 With the continuous increase in chip integration and the ongoing reduction in packaging size,Moore’s Law is gradually approaching its physical limits. To continue the development of Moore’s Law,traditional two-dimensional planar packaging is gradually evolved towards three-dimensional(3D) packaging.However, due to the complexity and heterogeneity of 3D packaging, as well as differences in the coefficients of thermal expansion(CTE) of different materials within the packaging structure, thermal stress concentrations tend to occur at interfaces under the combined effects of temperature cycling, high operating temperatures, and environmental stress. This can lead to mechanical failures such as solder joint fatigue fracture, through-silicon via(TSV) sidewall cracking, and interlayer delamination. Against this backdrop, 3D packaging mechanical simulation technology is recognized as an important means of solving such problems, and the necessity and urgency of related research are increasingly prominent. The existing research methods and latest advancements in mechanical simulation technology for 3D integrated circuit packaging are systematically reviewed. The typical mechanical failure modes of 3D packaging and the corresponding mechanical constitutive models and failure criteria are clarified. The basic principles, applicable scenarios, and technical limitations of the two core simulation methods, namely the finite element method(FEM) and the boundary element method(BEM), are classified and elaborated. Furthermore, the technological evolution logic of multiphysics coupling simulation methods based on FEM and BEM, as well as their application value in complex failure scenarios, are analyzed. The core bottlenecks of the current technical system are summarized,and its future development prospects are prospected.更多还原