【摘要】 使用Ni箔中间层SPS扩散连接金刚石/铜复合材料并分析了界面的元素，根据第一性原理密度泛函理论研究了扩散过程中的界面行为。结果表明，Ni中间层金刚石/铜复合材料扩散连接的界面是良好的冶金结合，Ni元素向界面两侧扩散与铜生成了CuNi合金的α-单相固溶体。铜/镍界面的声子、电子态密度图表明，这种二元界面的导热性能优于金刚石/铜、金刚石/镍界面，界面处高比例的铜/镍界面连接是其高导热性能的重要原因。添加Ni箔中间层的SPS扩散连接接头界面，其热导率最高可达703.83 W/(m·K)，镍与铜的无限固溶使接头的导热性能提高。更多还原

【Abstract】 Composite of diamond particulates/copper was fabricated through diffusion bonding with a thin Ni-foil as interlayer via a spark plasma sintering technique. Then the formed bonding interface was characterized by means of SEM+EDS, XRD, universal testing machine and thermal conductivity meter, in terms of its microstructure, fracture morphology, shear strength, and thermal conductivity. Meanwhile the effect of process parameters on the microstructure and thermal conductivity of the bonding interface was investigated, and the variation of the interface behavior during diffusion bonding process was also studied by the first principle calculation. The results showed that the formed interface presents excellent metallurgical bonding between the diamond particulates and the Cu. The presence of the thin Ni foil interlayer significantly reduced the formation of voids and holes at the diffusion-bonded interface. The diffusion of Ni led to the formation of an α single-phase Cu-Ni solid solution and the production of the Ni₃C phase. The phonon and electron density of states maps of the Cu/Ni-interface showed that the thermal conductivity of the binary interface was better than that of the diamond/nickel interface, and the high proportion of Cu/Ni-interface connection at the interface was an important factor in achieving high thermal conductivity. The spark plasma sintering induced diffusion joint interface presents thermal conductivity up to 703.83 W/（m·K）, while the infinite solid solution of Ni-Cu, as well as the generation of carbide is conducive to the thermal conductivity of the joint.更多还原