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残余应力对GH4169微观疲劳裂纹扩展行为的影响

Effect of Residual Stress on Micro Fatigue Crack Propagation Behavior of GH4169

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【作者】 雷雪雪崔元元刘芳王骁晓杨杰

【Author】 LEI Xuexue;CUI Yuanyuan;LIU Fang;WANG Xiaoxiao;YANG Jie;School of Energy and Power Engineering, University of Shanghai for Science and Technology;School of Mechanical Engineering, University of Shanghai for Science and Technology;Key Laboratory of Pressure Systems and Safety, Ministry of Education, East China University of Science and Technology;

【通讯作者】 杨杰;

【机构】 上海理工大学能源与动力工程学院上海理工大学机械工程学院华东理工大学承压系统安全科学教育部重点实验室

【摘要】 本研究以GH4169合金为研究对象,选用微观单边缺口含裂纹(M-SENT)试样,对不同拘束M-SENT试样模型上下两侧施加不同大小的均布载荷以在裂纹尖端产生不同应力。将该应力作为残余应力引入试样,基于建立的微观多晶疲劳裂纹扩展(MPFCP)模型,研究了残余应力和拘束交互作用对GH4169合金微观疲劳裂纹扩展(MFCP)行为的影响。研究结果表明:应变比R=0时,高拘束下疲劳裂纹扩展(FCP)速率对残余应力的变化更加敏感;R=-1时,不同拘束下FCP速率对残余应力的变化敏感度相差不大。不同拘束试样均存在一个最优的残余应力。高拘束下,R=0时试样的断裂寿命比R=-1时更高。

【Abstract】 This study used GH4169 alloy as the research object and employed microscopic single-edge notched tension(M-SENT) specimens with cracks. Different magnitudes of uniformly distributed loads were applied to the upper and lower sides of M-SENT specimen models with varying constraints to induce different stress levels at the crack tip. This stress was introduced into the specimens as a residual stress. Based on the established microscopic fatigue crack propagation(MPFCP) model, the influence of the interaction between residual stress and constraint on the microscopic fatigue crack propagation(MFCP) behavior of GH4169 alloy was systematically investigated. The results indicate that at a strain ratio of R=0, the fatigue crack propagation(FCP) rate under high constraint is more sensitive to changes in residual stress; at R=-1, the sensitivity of the fatigue crack growth rate to residual stress variations is relatively similar across different constraint levels. For all specimens with varying constraints, there exists an optimal residual stress level. Under high constraint conditions, the fracture life at R=0 is longer than that at R=-1.

【基金】 国家自然科学基金项目(52375154)
  • 【文献出处】 材料科学与工程学报 ,Journal of Materials Science and Engineering , 编辑部邮箱 ,2026年02期
  • 【分类号】TG132.3;V252
  • 【下载频次】16
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