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丝网印刷工艺参数对微细导电线条成型质量影响的研究
Effect of Screen Printing Process Parameters on the Forming Quality of Fine Conductive Lines
【摘要】 目的 为研究丝网印刷工艺对微细导电线条成型量的影响,探讨离网间隙、印刷速度和印刷压力对线条几何与表面质量的作用规律,确定适用于100μm×150 mm导电图形的最佳工艺参数。方法 通过正交试验设计考察3项关键工艺参数对线宽、线高及粗糙度的影响,引入灰色关联分析(GRA)对多指标进行综合评价,建立参数-成形质量关联模型,并对最优参数组合进行印刷验证。结果 分析表明,离网间隙影响最显著,其次为印刷速度和印刷压力。最优参数组合使印刷线条在宽度一致性、结构稳定性与表面质量方面均表现良好。验证印刷的导电线条连续性高、表面整齐,满足微细图形制备需求。结论 灰色关联分析可有效实现丝网印刷工艺的多指标优化。合理匹配离网间隙、印刷速度与压力能够显著提升导电线条成形质量,为柔性电子与金属网栅的高精度印刷提供可行的工艺指导。
【Abstract】 The work aims to investigate the effects of key screen printing parameters on the forming quality of fine conductive lines and explore the roles of snap-off distance, printing speed, and squeegee pressure on line geometry and surface quality, with the goal of identifying optimal conditions for printing 100 μm×150 mm conductive patterns. An orthogonal experimental design was employed to evaluate the impact of the three parameters on line width, line height, and surface roughness, while grey relational analysis(GRA) was introduced to achieve multi-index comprehensive evaluation and to establish a parameter–performance correlation model. The analysis indicated that snap-off distance exhibited the most significant effect, followed by printing speed and squeegee pressure. The optimized parameter combination yielded conductive lines with excellent width uniformity, structural stability, and surface quality. Printed samples verified under the optimal conditions showed high continuity and clean edges, meeting the requirements for fine-pattern fabrication. These findings demonstrate that GRA is an effective tool for multi-objective optimization of screen printing processes, and that appropriate coordination of snap-off distance, printing speed, and pressure can significantly enhance conductive line formation quality, providing practical guidance for high-precision printing in flexible electronics and metallic mesh applications.
【Key words】 screen printing; grey relational analysis; process optimization; conductive line;
- 【文献出处】 包装工程 ,Packaging Engineering , 编辑部邮箱 ,2026年03期
- 【分类号】TS871.1
- 【下载频次】56