【摘要】 传统的同步轧制工艺往往会产生贯穿板材厚度方向的显微组织和织构梯度。本研究以超高纯度(99.999%，质量分数)钽为原材料，采用可动态偏移和调整剪切力的轧制(DS轧制)工艺解决超高纯钽板的织构梯度问题，利用Deform 3D软件分析了超高纯钽板在DS轧制和同步轧制过程中的应变和应力分布，并且利用电子背散射衍射对材料厚度方向的织构和显微组织进行了表征。结果表明，DS轧制将平均切应变从0.05提高到0.56，有效地解决了超高纯钽板的织构梯度问题，且切应力显著降低了{100}和{111}晶粒的储能取向依赖性。此外，DS轧制可有效细化超高纯钽板再结晶晶粒，其平均晶粒尺寸减小了30.9%。更多还原

【Abstract】 Traditional symmetrical rolling often induces through-thickness gradient microstructures and textures. In this study, ultra-high purity(99.999 wt.%) tantalum(Ta) served as a model material to address the texture gradient issue by employing dynamic offsets and shear force adjustment rolling(DS rolling) as an advanced rolling technique. The strain and stress distributions in Ta plates for DS rolling and symmetrical rolling processes were analyzed using Deform 3D software. Through-thickness textures and microstructures were characterized via electron backscatter diffraction. The results revealed that DS rolling effectively solved the problem of texture gradient by increasing the average shear strain from 0.05 to 0.56. In turn, the shear stress reduced the energy storage orientation dependence of {100} and {111} grains. Furthermore, DS rolling refined the recrystallized grains on an average of 30.9%.更多还原