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金属化膏剂分散工艺研究

Research on Dispersion Process of Metalized Pastes

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【作者】 韦艳; 安宏禹; 于志强; 黄亦工;

【Author】 WEI Yan;AN Hong-yu;YU Zhi-qiang;HUANG Yi-gong;Beijing Vacuum Electronics Research Institute;

【机构】 北京真空电子技术研究所;

【摘要】 采用两种工艺制备95瓷用Mo-Mn膏,分别为直接加黏结剂工艺和先用溶剂分散后加黏结剂工艺,对两种样品进行了对比测试。结果表明,直接加黏结剂工艺,最终烧结的Mo-Mn层与陶瓷之间有大量孔洞,金属–陶瓷封接强度低。先用溶剂分散然后加黏结剂工艺,最终烧结的Mo-Mn层与陶瓷之间没有孔洞,封接强度高。

【Abstract】 Two processes are used to prepare Mo-Mn paste for 95% Al2O3 ceramics. One is to add binder to the powder directly, and the other is to disperse the binder with a solvent before adding. Comparison test is carried out and the results show that when the binder is directly added, there are a large number of pores between the final sintered Mo-Mn layer and the ceramic, and the metal-ceramic sealing strength is low; when the binder is dispersed and added, there are no pores between the Mo-Mn layer and the ceramic, and the sealing strength is high.

  • 【文献出处】 真空电子技术 ,Vacuum Electronics , 编辑部邮箱 ,2025年01期
  • 【分类号】TQ174.4
  • 【下载频次】10
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