【摘要】 随着半导体电子器件的集成化与小型化发展，金刚石优异的热导性、电导性成为制备半导体衬底的理想材料。为了满足半导体行业对电子器件高精度和高可靠性能的要求，需对金刚石表面进行抛光处理。然而，金刚石高硬度、高耐磨性、高化学惰性的特点，使金刚石的加工面临诸多困难，现有的金刚石抛光技术都有一定的自身优势和不足，急需一种在保证效率的情况下，同时获得光滑、平整、低损伤的金刚石表面抛光技术。因此，本文对金刚石抛光技术的国内外相关文献进行了梳理，总结了机械抛光、热化学抛光、化学机械抛光、等离子体刻蚀抛光、激光抛光等技术的原理与优缺点，对未来金刚石抛光技术来说，应朝着多种技术相互搭配以及智能化、精密化、环保化的方向发展，进而拓展金刚石材料的应用范围。更多还原

【Abstract】 With the integration and miniaturization of semiconductor electronic devices, the excellent thermal and electrical conductivity of diamond has made it an ideal material for preparing semiconductor substrates. The polished diamond surface is smoother, which can meet the requirements of semiconductor industry for high precision and high reliability, and has important value and significance in improving the performance of semiconductor equipment, prolonging service life and optimizing thermal management. However, the high hardness, wear resistance, and chemical inertness of diamonds pose significant challenges in their processing. Existing diamond polishing technologies have their own advantages and limitations, creating an urgent need for a polishing technology that achieves a smooth, flat, and low-damage diamond surface while ensuring efficiency. Therefore, this paper reviewed relevant literature in China and abroad on diamond polishing technology, summarizing the principles, advantages, and disadvantages of mechanical polishing(MP),thermochemical polishing(TCP), chemical mechanical polishing(CMP), plasma etching polishing(PEP), laser polishing(LP), and other methods. Future diamond polishing technology should develop in the direction of multi-technology integration, intelligence, precision, and environmental friendliness, thereby expanding the application range of diamond materials.更多还原