【摘要】 为克服无机/有机复合薄膜封装技术在商业化应用中因有机层过厚而导致的器件柔韧性下降及侧边渗透风险增加的问题，本研究围绕封装层整体减薄的需求，系统探究了减薄后有机层的阻隔性能与层间黏附性的协同优化路径。采用纳米复合策略，分别将人工合成的层状硅酸镁锂（Laponite）及其经十六烷基三甲基氯化铵（CTAC）改性后的纳米片作为增强体引入聚甲基丙烯酸甲酯（PMMA）基体中，与SiN_x薄膜共同构建整体减薄的“三明治”结构复合封装薄膜。研究结果表明，纳米片的引入通过构建曲折路径显著增强了复合薄膜的水汽阻隔性能。相较于本征Laponite体系，CTAC改性后的纳米片因其表面疏水化及在PMMA基体中的优异分散性，使所得CTAC-Laponite-PMMA复合薄膜的综合性能显著提升，表面粗糙度降至0.312 nm，有效保障了与上下无机层之间的界面黏附性，整体“三明治”结构复合封装薄膜的水汽透过率进一步降低至5.90×10^-5 g/（m2·day）。该研究通过有机改性Laponite纳米片，协同优化了减薄后有机层的阻隔性与界面黏附性，为超薄高性能柔性封装提供了新思路，展现出良好的应用潜力。更多还原

【Abstract】 To address the loss of flexibility and increased risk of side penetration in commercially applied inorganic/organic composite encapsulation films—issues often resulting from overly thick organic layers, this study investigates strategies for synergistically optimizing the barrier properties and interlayer adhesion of thinned organic layers. We constructed a thinned “sandwich-structured” composite film by incorporating synthesized lithium magnesium silicate(Laponite) nanosheets, both pristine and modified with cetyltrimethylammonium chloride(CTAC), into a polymethyl methacrylate(PMMA) matrix, which was then laminated with silicon nitride(SiN_x) layers. The results demonstrate that the incorporated nanosheets significantly enhance the water vapor barrier performance by creating a tortuous diffusion path. Compared to the pristine Laponite system, the CTAC-modified nanosheets, owing to their hydrophobic surface and superior dispersion within the PMMA matrix, led to a remarkable improvement in the overall performance of the CTAC-Laponite-PMMA composite. The resulting film exhibited an ultra-low surface roughness of 0. 312 nm, ensuring excellent interfacial adhesion with the adjacent inorganic layers. Consequently, the water vapor transmission rate(WVTR) of the entire sandwich structure was further reduced to 5. 90×1. This work demonstrates a novel approach to co-optimizing barrier properties and interfacial adhesion in thinned organic layers via organically modified nanosheets, offering a promising pathway for developing high-performance, ultra-thin flexible encapsulation.更多还原