【摘要】 近年来,取向石墨烯气凝胶制备技术渐趋成熟,但受限于石墨烯片层柔性与气凝胶微观结构,存在骨架强度低、压缩回弹性和柔韧性不足等问题,其应用拓展受限。本研究借助氧化石墨烯（GO）自组装驱动力和π-π相互作用使碳纳米管（CNT）附着于GO片,利用水塑形发泡技术搭建取向性碳骨架。CNT的引入显著增强骨架强度,赋予气凝胶优异压缩回弹性。本研究采用冷压工艺,大幅提升气凝胶导热性能与柔韧性,为高性能气凝胶开发提供新思路。测试表明,所得石墨烯复合气凝胶CP-GA/C沿孔隙堆积方向压缩回弹率超90%及500次压缩循环,水平方向可承受超10 000次弯折,面内热导率达64.5 W·m^-1·K^-1。填充相变材料时,高孔隙率碳骨架使材料相变填充率高,相变焓>150 J/g。凭借碳骨架柔韧性,相变材料可按预设形状弯折,适配设备外形,提升实际应用适配性。更多还原

【Abstract】 Oriented graphene aerogels have limited applications because the flexibility of their graphene sheets and microstructure give them a low skeleton strength,insufficient compression resilience,and poor flexibility.We report the preparation of novel aerogel materials with a much better performance.Using the driving force of graphene oxide（GO）self-assembly and π-π interactions,carbon nanotubes（CNTs）were attached to the GO sheets,and an oriented composite carbon skeleton was constructed using "hydro-plastic foaming".The introduction of CNTs significantly increased the strength of the skeleton and gave the aerogel an excellent reversible compressibility.The innovative use of cold pressing greatly improved the thermal conductivity and flexibility of the aerogel,providing new ideas for the development of high-performance aerogels.Tests show that the obtained graphene composite aerogel has a reversible compressive strain of over 90% and can withstand 500 compression cycles along the direction of pore accumulation.It can endure more than 10 000 bending cycles perpendicular to the direction of composite carbon layer stacking,and its in-plane thermal conductivity reaches 64.5 W·m^-1 K^-1.When filled with phase change materials,the high porosity of the carbon skeleton enables the material to have a high phase change filling rate,and its phase change enthalpy is greater than 150 J/g.Thanks to the exceptional flexibility of the carbon skeleton,the macrostructure of phase change materials can be bent as needed to adapt to thermal management scenarios and conform to device shapes.This significantly enhances practical application compatibility,providing flexible support for temperature control and thermal management across diverse device forms.更多还原