【摘要】 光敏聚酰亚胺（PSPI）具有优异的感光性、机械性以及良好的化学和热稳定性，近年来被广泛应用于先进封装、微电子系统、有机发光二极管显示等新兴领域。首先根据曝光区溶解性的差异详细阐述了目前正性PSPI和负性PSPI的种类、结构与性能；随后从PSPI的结构设计、PSPI制备过程中添加剂的加入、PSPI原料配方的改进3个方面系统分析了PSPI光敏性能的提升策略；紧接着对PSPI在集成电路、微电子、3D打印以及生物医学器件等领域的应用和未来发展趋势进行了全面介绍；最后对PSPI的光敏性、化学稳定性、耐热性、机械性、环保性的进一步优化提出了调整PSPI聚合条件、开发新型光敏剂、增强PSPI抗溶剂性、引入交联剂、优化PSPI制备方法等建设性意见。更多还原

【Abstract】 In recent years,photosensitive polyimide(PSPI)has been widely employed in emerging fields such as advanced packaging,microelectronics systems,and organic light-emitting diode displays due to its excellent photosensitivity,mechanical properties,and outstanding chemical and thermal stability. In this review,the types,structures and properties of positive PSPIs and negative PSPIs are described in detail according to the differences in solubility in the exposure area. Subsequently,the strategies for improving the photosensitive performance of PSPIs are systematically analyzed from three aspects:the structural design of PSPIs,the addition of additives in the preparation process of PSPIs,and the improvement of PSPI raw material formulations. Then,the applications and future development trends of PSPI in the fields of integrated circuits,microelectronics,3D printing and biomedical devices are comprehensively introduced. Finally,some constructive suggestions for further optimization of photosensitivity,chemical stability,heat resistance,mechanical properties,and environmental friendliness of PSPIs are put forward,including adjusting the polymerization conditions of PSPIs,developing new photosensitizers,enhancing the solvent resistance of PSPIs,introducing crosslinkers,and optimizing the preparation methods of PSPIs.更多还原