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线接触联动薄膜压力敏感芯片结构分析

Analysis of Line contact linkage film capacitive pressure-sensitie chip

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【作者】 张志浩赵宏建王健行揣荣岩

【Author】 ZHANG Zhihao;ZHAO Hongjian;WANG Jianxing;CHUAI Rongyan;School of Information Science and Engineering,Shenyang University of technology;Chinese People′s Liberation Army air force 93156 army;

【通讯作者】 赵宏建;王健行;揣荣岩;

【机构】 沈阳工业大学信息科学与工程学院中国人民解放军空军93156部队

【摘要】 MEMS技术催生了多种类型的传感器,其中电容式压力传感器应用广泛。然而,非接触电容式压力传感器存在非线性度大的问题,而接触电容式压力传感器虽然能够降低非线性度,但迟滞现象较为明显。为克服这些缺点,设计了一种线接触联动薄膜敏感结构。该结构使上极板与下极板的接触面积趋近于零,形成线接触,从而显著降低迟滞并减小非线性度。通过构建模型进行仿真,并优化结构参数,确定了芯片的压力范围、非线性度和灵敏度。该设计可广泛应用于汽车电子、化工等领域。

【Abstract】 MEMS technology has brought many types of sensors, among which capacitive pressure sensor is widely used, while non-contact capacitive pressure sensor has a large nonlinear degree. Although the contact capacitive pressure sensor can reduce the nonlinearity, the hysteresis is larger. In order to improve these problems, a wire contact linkage film sensitive structure is designed. In this structure, the contact area between the upper plate and the lower plate is close to zero, and the linear contact reduces the hysteresis and the nonlinearity. The model simulation is constructed, and the structural parameters of the model are optimized to determine the pressure range, nonlinearity and sensitivity of the chip. It can be widely used in automotive electronics, chemical industry and other fields.

  • 【分类号】TP212;TN40
  • 【下载频次】28
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