【摘要】 以两种凝胶剂（配方1为琼脂-魔芋胶、配方2为明胶）为基础，添加不同质量分数（0%、0.5%、1.0%和2.0%）金耳（Naematelia aurantialba）粗多糖（NAP）制备软糖，采用流变仪测定软糖糖浆静态和动态流变学特性，采用质构仪测定软糖质构特性。结果表明：当NAP添加量从0%增至2.0%时，配方1软糖糖浆的稠度系数（k）由66.759 Pa·s~n升至146.960 Pa·s~n，流动行为指数（n）从0.264降至0.154；配方2软糖糖浆的k由88.566 Pa·s~n升至455.540 Pa·s~n,n从0.461降至0.134。基于配方1制备的软糖，2.0%NAP的硬度最大，0.5%NAP的弹性、回复性和黏聚性最大，1.0%NAP的胶着性和咀嚼性最大。基于配方2制备的软糖，1.0%NAP的硬度最大；0.5%NAP的黏性和脆性最小，弹性最大；2.0%NAP的回复性和黏聚性最小，胶着性和咀嚼性最大。研究结果可为金耳粗多糖在功能性软糖中的应用提供参考。更多还原

【Abstract】 Using two gelling agents, agar-konjac gum(formula 1) and gelatin(formula 2) as bases, gummy candies were prepared with the addition of Naematelia aurantialba crude polysaccharide(NAP) at different mass concentrations(0%, 0.5%, 1.0%, and 2.0%). The static and dynamic rheological properties of the candy syrups of both formulas added with different concentrations of NAP were measured using a rheometer, and the textural properties of the resultant gummy candies were determined using a texture analyzer. The results showed that as the NAP concentration increased from 0% to 2%, the consistency coefficient(k) of formula 1 candy syrups increased from 66.759 Pa·s~n to 146.96 Pa·s~n, whereas its flow behavior index(n) decreased from 0.264 to 0.154. For formula 2 candy syrups, the k value increased from 88.566 Pa·s~n to 455.54 Pa·s~n, and the n value decreased from 0.461 to 0.134. In formula 1 gummy candies, 2.0% NAP resulted in the highest hardness, while 0.5% NAP yielded the maximum elasticity, cohesiveness, and springiness. In formula 2, gummy candies reached the highest hardness with the addition of 1.0% NAP. Formula 2 gummy candies with 0.5% NAP had the lowest adhesiveness and fracturability, but the highest springiness. On the other hand, 2.0% NAP resulted in the lowest springiness and cohesiveness, yet the highest gumminess and chewiness. These results suggested that NAP significantly modulated the rheological and textural characteristics of gummy candies, providing a valuable reference for developing functional gummies containing N. aurantialba crude polysaccharide.更多还原