【摘要】 为了探索密封装置在温度变化工况下产生的力学行为，使用ANSYS Workbench软件，采用热-固耦合的方法对其进行有限元分析。通过创建模型、划分网格、施加载荷及定义边界条件等软件操作，完成求解计算。经过后处理，得到装置变形图、Von Mises应力图和接触压强图并对其进行分析。基于计算得到的接触压强对比环氧树脂的黏结强度，进而判断装置密封面是否失效。此次有限元分析得到的数据和规律可为环氧树脂密封技术提供技术支撑。更多还原

【Abstract】 In order to explore the mechanical behavior of the device structure under temperature change conditions, ANSYS Workbench software is used to analyze the finite element using the thermal-solid interaction method. The solution calculation is completed through software operations such as model creation, meshing, load application, and definition of boundary conditions. After post-processing, the device deformation diagram, Von Mises stress diagram and contact pressure diagram are obtained and analyzed. Based on the calculated contact pressure value compared with the bond strength value of the epoxy resin, the sealing surface of the device is judged to be invalid. The data and rules obtained from this finite element analysis can provide technical support for epoxy resin sealing technology.更多还原