【摘要】 通过VIKOR法对最佳工艺参数进行优化和选择可以提高焊点的焊接质量。以激光功率、激光作用时间和焊接温度为输入因素，以焊点的空洞率和润湿角角度为输出对象，采用VIKOR法对两个输出对象优化，以确保输入因素的最佳水平。进一步地，设计了Taguchi试验，将得到的结果与VIKOR法得到的优化方案进行对比，验证了VIKOR法在激光焊接参数优化上的优越性。实验结果表明，设置激光功率为60 W,激光作用时间为1 s,焊接温度为260℃时，焊点空洞率和润湿角角度分别为3.1%和23.3°,满足了电子元器件的焊接需求。通过对比VIKOR法和Taguchi法下的实验结果可知，在一定参数范围内，空洞率相对于润湿角角度对剪切推力有着更大的影响。更多还原

【Abstract】 The welding quality of solder joints can be improved by optimizing and selecting the optimal process parameters through the VIKOR method. In this paper, the laser power, laser action time and welding temperature are taken as input factors, and the void rate and wetting angle of the solder joint are taken as output objects. The VIKOR method is used to optimize the two output targets to determine the optimal level of input factors. Furthermore, the Taguchi experiment is designed in this paper, and the results are compared with the optimization scheme obtained by VIKOR method, which verified the superiority of the VIKOR method in the optimization of laser welding parameters. The experimental results show that when the laser power is set to 60 W, the laser action time is set to 1 s, and the welding temperature is set to 260 ℃, the void rate and wetting angle of the solder joint are 3.1% and 23.3°, respectively, which meet the welding requirements of electronic components. By comparing the experimental results of the VIKOR method and the Taguchi method, it can be concluded that within a certain parameter range, the void rate has a greater influence on the shear thrust than the wetting angle.更多还原