【摘要】 阐述氮化铝铝基散热板材的种类和特性。在铝基板上开槽并镶嵌氮化铝，氮化铝的散热系数可达275W/(m·K)，嵌入氮化铝后可有效提高元器件的散热效果。通过在器件安装位的侧面开槽嵌入氮化铝，使得氮化铝的面积不受器件安装位上两个连接点的间距影响，并可根据散热需求规划各个氮化铝的面积，使得PCB基板的散热效果更好。更多还原

【Abstract】 This paper describes itride(AlN). By grooving the aluminum substrate and embedding AlN, the thermal conductivity of AlN can reach up to 275 W/(m·K), effectively enhancing the heat dissipation performance of components. Grooving and embedding AlN on the sides of the component mounting positions allows the area of AlN to be independent of the spacing between the two connection points on the mounting position, enabling the planning of AlN areas according to heat dissipation requirements, thereby improving the heat dissipation performance of the PCB substrate.更多还原