【摘要】 近年来，随着摩尔定律逐渐放缓，晶上系统（System on wafer, SoW）技术作为最热门的“超越摩尔”技术路线之一，已经成为先进封装领域的研究热点。基于晶上系统技术，将传统的毫米波收发前端阵列组件进行三维重构集成，可实现全新的轻薄化毫米波晶上阵列，具有“三免”（免连接器、免电缆、免管壳封装）的颠覆性结构。本文针对毫米波晶上阵列的自动化测试需求，创新性提出一种毫米波双面晶圆测试方法，突破了多尺寸双面晶圆可靠固定、双面探针精确对准和自动切换以及扎针强度精确控制和实时调节等关键技术，在此基础上研制出毫米波双面晶圆自动测试平台，解决了毫米波收发前端晶上阵列三维测试的难点，对毫米波晶上系统的测试具有重大参考价值。更多还原

【Abstract】 In recent years, with the gradual slowdown of Moore’s law, SoW(System on wafer) technology, as one of the most popular "beyond Moore" technology routes, has become a research hotspot in the field of advanced packaging. Based on SoW technology, the traditional millimeter wave transceiver front-end arrays components are reconstructed and integrated in 3D to realize a new thin and light millimeter wave arrays on wafer with a subversive structure of "three free"(Connector free, cable free, package free). Aiming at the requirements of automatic testing of millimeter wave arrays on wafer, this paper proposes an innovative double-sided wafer test method, which breaks through key technologies such as reliable fixation of multi-dimensional double-sided wafer, accurate alignment and automatic switching of double-sided probes, precise control and real-time adjustment of pin strength, and on this basis develops the world’s first automatic testing platform for millimeter wave double-sided wafer. It solves the difficulty of the 3D test of the millimeter wave transceiver front-end arrays on wafer, has great reference value for the test of millimeter wave system on wafer.更多还原