【摘要】 放电等离子体广泛应用于半导体芯片制造，包括光刻、刻蚀、薄膜沉积、离子注入、等离子体清洗等，其技术总成占据集成电路产业份额1/3以上，已发展成为芯片制造工艺与装备领域的关键核心技术。该文对气体放电与等离子体在芯片制造领域的典型应用进行了概述。首先，针对光刻光源系统，介绍了气体放电泵浦准分子激光、激光产生等离子体辐射极紫外光的基本原理，其本质都是利用等离子体产生的光辐射；其次，针对刻蚀用射频等离子体，介绍了低气压射频放电的产生、特性、调控及相关工艺技术；再次，对薄膜工艺、离子注入装备原理及相关放电等离子体技术原理进行了介绍与讨论；随后，在量测与检测方面，分别介绍了光学检测与电子束检测的特点，阐述了激光维持等离子体实现宽谱强辐射光源的基本原理与特性；最后，介绍了基于辉光放电的等离子体清洗技术，以及其在去除刻蚀残留物中的应用。通过总结梳理气体放电与等离子体在半导体制造领域中的应用及相关核心技术，明晰放电等离子体科学基础研究方向，助力解决半导体装备国产化过程中的等离子体技术瓶颈。更多还原

【Abstract】 Discharge plasma is widely used in semiconductor chip manufacturing, including lithography, etching, thin film deposition, ion implantation, and plasma cleaning. The technology of discharge plasma occupies more than one third of the integrated circuit industry and has developed into a key technology in the field of chip manufacturing processes and equipment. This paper provides an overview of the typical applications of gas discharge and plasma in the field of chip manufacturing. Firstly, for lithography light source systems, the basic principles of gas discharge-pumped excimer lasers and extreme ultraviolet light generated by laser-produced plasmas are introduced. The essence of both is to utilize the light radiation generated by plasma. Secondly, for the radio frequency plasma used in etching, the generation, characteristics, control and related process technologies of low-pressure radio frequency discharge are introduced. Thirdly, the principles of thin film process, ion implantation equipment and related discharge plasma technology are introduced and discussed. Subsequently, in the aspects of measurement and detection, the characteristics of optical detection and electron beam detection are introduced respectively, and the basic principles and characteristics of laser sustained plasma to realize wide-spectrum strong radiation light source are elaborated. Finally, the plasma cleaning technology based on glow discharge and its application in removing etching residues are introduced. By summarizing and sorting out the applications of gas discharge and plasma in semiconductor manufacturing and related core technologies, the research direction of the scientific basis of discharge plasma is clarified, which helps to solve the plasma technology bottleneck in the process of domestication of semiconductor equipment.更多还原