【摘要】 芯片的集成化使得换热空间减小，而微小换热结构的压降和泵功普遍较大，不利于节能减排。为权衡压降和换热，本文针对受限空间下高功率单芯片散热问题，分别对空流道及全填充泡沫铜射流冲击换热装置开展了多组水冷实验研究，并基于评价因子对填充针肋结构泡沫铜的装置进行了优化设计与实验。实验得到，泡沫铜孔隙率为96%时，大流量下全填充20 PPI泡沫铜的装置综合效果最好；在入口雷诺数小于1492时，填充20 PPI叉排针肋泡沫铜装置综合性能最优。更多还原

【Abstract】 The integration of chips reduces the heat transfer space, while the pressure drop and pump power of small heat transfer structures are generally large, which is not conducive to energy saving and emission reduction. In order to balance the pressure drop and heat transfer, aiming at the heat dissipation problem of high power single chip in confined space, this paper carried out multiple sets of water cooling experiments on the air channel and the fully filled copper foam jet impinged heat transfer device, and carried out optimization design and experiments on the device filled with copper foam with needle rib structure based on evaluation factors. The results show that when the porosity of copper foam is 96%, the device filled with 20 PPI copper foam at large flow rate has the best comprehensive effect. When the inlet Reynolds number is less than 1492, the comprehensive performance of the device filled with 20 PPI is optimal.更多还原