【摘要】 有源相控阵天线的高功率和集成化发展导致内部关键功能单元T/R组件的热通量攀升，进一步致使内部热敏元件温漂及天线电性能恶化。文中针对常规冷板展开结构创新，基于嵌入式思想结合局部加密的微通道优化策略，针对T/R组件的高热流密度与局部热点问题，设计了一种四棱锥形微肋圆阵列的微尺度结构。通过仿真模型探究不同热源功率与微肋阵排布位置的协同优化结果，发现加密排布结构有利于高热源功率下的散热，器件最高温度降低了22.58 K，温度均匀性改善了22.5%。将结构置于远热源位置可提升嵌入式冷板的热对流过程，置于近热源位置可进一步提升散热性能，但会增大电子器件整体布局设计与封装的难度。以上研究为解决T/R组件等大功率电子器件嵌入式冷却散热问题提供了理论指导。更多还原

【Abstract】 The development of high power and integration of active phased array antenna leads to increase of the heat flux of the key functional unit T/R module and further causes the temperature drift of the internal thermal element and the electrical performance deterioration of the antenna. In this paper, the structural innovation of the conventional cooling plate is carried out. Based on the embedded ideology and combined with the microchannel optimization strategy of local densification, a quadrangular pyramid-shaped micro-rib array structure is designed for the high heat flow and localized hotspot problem. Simulations reveal that denser micro-rib configurations reduce the maximum temperature of the device by 22.58 K and improve temperature uniformity by 22.5%under high-power conditions.When the micro-rib array is placed far from heat sources,embedded cooling performance will be improved.While the micro-rib array is placed near heat sources,embedded cooling performance will be further improved,but it will make the whole layout design and packaging of the electronic devices more difficult.These results provide theoretical insights for solving embedded cooling problem in highpower electronic devices like T/R modules.更多还原