【摘要】 ZnO基压敏陶瓷因其优异的非线性电流-电压特性、快的响应速度及强瞬态能量吸收能力等优势而具有过电压保护功能，被广泛应用于电子领域。然而商用ZnO-Bi₂O₃系压敏陶瓷烧结温度高，存在第二相挥发偏离设计组成、晶粒尺寸均匀性差、能耗大等一系列问题，不满足高端应用和国家节能环保的战略需求。近年来提出的冷烧结技术（Cold sintering process, CSP）在中间液相、单轴压力和温度的协同作用下，不超过350℃即可实现陶瓷材料致密化。目前，已实现四元掺杂的ZnO基压敏陶瓷及ZnO-有机复合压敏陶瓷的冷烧结制备。本文综述了冷烧结工艺及其致密化机理、制备条件对致密化的影响，并对冷烧结在ZnO基压敏陶瓷中的应用进行了分类概述，最终展望了冷烧结技术在压敏器件中的发展趋势。更多还原

【Abstract】 ZnO-based varistor ceramics are extensively employed in the field of electronics, owing to their excellent nonlinear current-voltage characteristics, fast response speed and robust transient energy absorption capabilities. However, the high sintering temperature of commercial ZnO-Bi₂O₃ varistor ceramics leads to a series of problems such as the volatilization of secondary phases deviating from the designed composition, poor grain size uniformity, and high energy consumption, thereby falling to meet the requirements for high-end applications and the national strategies for energy conservation and environmental protection. The cold sintering process（CSP） technology proposed in recent years can achieve the densification of ceramic materials at no more than 350 ℃ under the synergistic effect of the intermediate liquid phase, uniaxial pressure and temperature. Currently, the cold sintering preparations of quaternary doped ZnO-based varistor ceramics and ZnO-organic composite varistor cera-mics have been achieved. This paper reviews the cold sintering process and its densification mechanism, the influence of preparation conditions on densification, and classifies and summarizes the application of cold sintering in ZnO-based varistor ceramics. Finally, the development trend of cold sintering technology in varistor devices is prospected.更多还原