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先进铜基复合材料的研究与发展(英文)

Research and development of advanced copper matrix composites

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【作者】 肖柱; 丁燕军; 王泽军; 贾延林; 姜雁斌; 龚深; 李周;

【Author】 Zhu XIAO;Yan-jun DING;Ze-jun WANG;Yan-lin JIA;Yan-bin JIANG;Shen GONG;Zhou LI;School of Materials Science and Engineering, Central South University;Key Laboratory of Non-ferrous Metal Materials Science and Engineering,Ministry of Education;

【通讯作者】 李周;

【机构】 中南大学材料科学与工程学院; 中南大学有色金属材料科学与工程教育部重点实验室;

【摘要】 铜基复合材料(CMCs)通过将纯铜与复合相的功能特性结合,展现出广阔的应用潜力。随着航空航天、微电子及智能终端技术的迅速发展,对具备优异力学和电性能CMCs的需求日益增长。本文综述了各种典型CMCs的设计原理、制备方法及组织与性能,总结了Cu基体中复合相的分布形态及其对显微组织演变和综合性能的影响,并深入探讨了其强化机制和机理。研究结果揭示了增强相与材料性能之间的内在关系,为开发综合性能更优的CMCs提供了重要的理论支持。最后,展望了CMCs的未来应用方向和发展趋势。

【Abstract】 Copper matrix composites(CMCs) offer promising applications by combining the functional characteristics of copper with composite phases. With the rapid advancement in aerospace, microelectronics, and intelligent terminal engineering, the demand for CMCs with superior mechanical and electrical properties has become increasingly critical. This paper reviews the design principles, preparation methods, microstructures and properties of some typical CMCs. The existing form of composite phases in the Cu matrix and their effects on microstructure evolution and comprehensive properties are summarised. Key underlying mechanisms governing these enhancements are discussed. The results provide a systematic understanding of the relationship between reinforcement phases and properties, offering insights for the future development of CMCs aimed to achieve much better comprehensive properties. The paper concludes by outlining the development trends and future outlook for the application of CMCs.

【基金】 the financial support by the Key-Area Research and Development Program of Guangdong Province, China (No. 2024B0101080003);Hunan Provincial Natural Science Foundation of China (No. 2024JJ2076);grants from the State Key Laboratory of Powder Metallurgy, Central South University, China
  • 【文献出处】 Transactions of Nonferrous Metals Society of China ,中国有色金属学报(英文版) , 编辑部邮箱 ,2024年12期
  • 【分类号】TB33
  • 【下载频次】37
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