【摘要】 针对SiC磨削工艺难以选择合适砂轮浓度的问题，开展了磨粒分布间距影响下的SiC材料去除有限元数值模拟研究。首先，根据砂轮上磨粒分布特征明确磨粒周向间距变化范围，确定对应磨粒粒径下的磨粒周向间距参数，并建立多磨粒刻划的有限元模型；然后，分析磨粒不同周向间距下的干涉应力表面形貌、横向裂纹和干涉应力分布均匀性，揭示磨削过程中磨粒周向间距对SiC材料去除的影响机制；最后，构建“砂轮浓度—体积分数—周向间距”的函数关系，提出一种基于磨粒周向排布的磨削砂轮浓度选择方法。研究结果能够为SiC磨削工艺中砂轮浓度的选择提供科学依据，以获得高表面形貌、低亚表面损伤和一致性均匀加工的SiC磨削工艺技术。更多还原

【Abstract】 In order to solve the problem that it is difficult to select the appropriate grinding wheel concentration in silicon carbide grinding process, the finite element numerical simulation study of SiC material removal under the influence of abrasive grits distribution spacing was carried out.Firstly, according to the distribution characteristics of abrasive grits on the grinding wheel, the variation range of circumference spacing was determined.Confirm the circumferential spacing parameters of abrasive grits with corresponding particle size and establish the finite element model of multi-abrasive grits scratching.Then analyse the surface morphology, subsurface crack propagation and stress distribution characteristics under different circumferential spacing of abrasive grits to reveal the effect mechanism of circumferential spacing on SiC material removal during grinding process.Finally, the function relationship of "grinding wheel concentration-volume fraction-circumferential spacing" was constructed, and a method of grinding wheel concentration selection based on the circumferential distribution of abrasive grits was proposed.The results of this study can provide scientific basis for selecting the grinding wheel concentration in SiC grinding process, so as to obtain the SiC grinding technology with high quality surface morphology, low sub-surface damage and uniform processing.更多还原