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Interfacial stress engineering toward enhancement of ferroelectricity in Al doped HfO2 thin films

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【作者】 陈思学陈明明刘圆曹大威陈国杰

【Author】 S X Chen;M M Chen;Y Liu;D W Cao;G J Chen;Department of Microelectronics, Jiangsu University;Department of Physics, Jiangsu University;Guangdong–Hong Kong–Macao Joint Laboratory for Intelligent Micro-Nano Optoelectronic Technology,Foshan University;

【通讯作者】 陈明明;

【机构】 Department of Microelectronics, Jiangsu UniversityDepartment of Physics, Jiangsu UniversityGuangdong–Hong Kong–Macao Joint Laboratory for Intelligent Micro-Nano Optoelectronic Technology,Foshan University

【摘要】 Ferroelectric HfO2 has attracted much attention owing to its superior ferroelectricity at an ultra-thin thickness and good compatibility with Si-based complementary metal-oxide-semiconductor(CMOS) technology.However,the crystallization of polar orthorhombic phase(o-phase) HfO2 is less competitive,which greatly limits the ferroelectricity of the as-obtained ferroelectric HfO2 thin films.Fortunately,the crystallization of o-phase HfO2 can be thermodynamically modulated via interfacial stress engineering.In this paper,the growth of improved ferroelectric Al doped HfO2(HfO2:Al)thin films on(111)-oriented Si substrate has been reported.Structural analysis has suggested that nonpolar monoclinic HfO2:Al grown on(111)-oriented Si substrate suffered from a strong compressive strain,which promoted the crystallization of(111)-oriented o-phase HfO2 in the as-grown HfO2:Al thin films.In addition,the in-plane lattice of(111)-oriented Si substrate matches well with that of(111)-oriented o-phase HfO2,which further thermally stabilizes the o-phase HfO2.Accordingly,an improved ferroelectricity with a remnant polarization(2Pr) of 26.7 μC/cm2 has been obtained.The results shown in this work provide a simple way toward the preparation of improved ferroelectric HfO2 thin films.

【Abstract】 Ferroelectric HfO2 has attracted much attention owing to its superior ferroelectricity at an ultra-thin thickness and good compatibility with Si-based complementary metal-oxide-semiconductor(CMOS) technology.However,the crystallization of polar orthorhombic phase(o-phase) HfO2 is less competitive,which greatly limits the ferroelectricity of the as-obtained ferroelectric HfO2 thin films.Fortunately,the crystallization of o-phase HfO2 can be thermodynamically modulated via interfacial stress engineering.In this paper,the growth of improved ferroelectric Al doped HfO2(HfO2:Al)thin films on(111)-oriented Si substrate has been reported.Structural analysis has suggested that nonpolar monoclinic HfO2:Al grown on(111)-oriented Si substrate suffered from a strong compressive strain,which promoted the crystallization of(111)-oriented o-phase HfO2 in the as-grown HfO2:Al thin films.In addition,the in-plane lattice of(111)-oriented Si substrate matches well with that of(111)-oriented o-phase HfO2,which further thermally stabilizes the o-phase HfO2.Accordingly,an improved ferroelectricity with a remnant polarization(2Pr) of 26.7 μC/cm2 has been obtained.The results shown in this work provide a simple way toward the preparation of improved ferroelectric HfO2 thin films.

【基金】 Research Fund of Guangdong–Hong Kong–Macao Joint Laboratory for Intelligent Micro-Nano Optoelectronic Technology, China (Grant No. 2020B1212030010);Project of Faculty of Agricultural Equipment of Jiangsu University (Grant No. NZXB20210202)
  • 【文献出处】 Chinese Physics B ,中国物理B , 编辑部邮箱 ,2024年09期
  • 【分类号】O469
  • 【下载频次】6
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