【摘要】 为顺应电子产品轻薄化、小型化以及多功能化的发展趋势，印制电路板的集成度也越来越高。高集成化在印制电路板上则主要表现为高纵横比（层数提高、板厚增加、通孔钻咀减小）叠加外层精细线路。不论是单通道传输速率112 Gbps的数通产品，还是Eagle Stream平台的服务器产品，均符合这一设计特点。铜厚对外层精细线路的蚀刻品质影响显著，而高纵横比的设计却又大大增加了铜厚管控的难度。因此，文章对设计有23?1高纵横比及外层线宽线距4/4 mil的测试板，进行了镀孔、酸减铜以及单面电镀三种加工方案的研究。不仅优化了三种方案的工艺流程设计，也探讨了三种方案的工艺关键控制点，还对实验结果进行了讨论及可靠性测试。最后分析了三种方案的品质异常风险点，并针对部分风险点提供了预防、改善建议。更多还原

【Abstract】 In order to comply with the development trend of thin, miniaturized and multi-functional electronic products,the integration of printed circuit boards is also getting higher and higher. High integration on the printed circuit board is mainly manifested as a high aspect ratio superimposed outer fine lines, it includes the increase of layer number, the increase of plate thickness and the decrease of through hole drill. Whether a single-channel transmission rate of 112Gbps digital communication products, or the Eagle Stream platform server products are in line with this design characteristics. Copper thickness has a significant influence on the quality of fine line etching in the outer layer, but the design of high aspect ratio greatly increases the difficulty of copper thickness control. In this paper, three processing schemes of hole plating, acid copper reduction and single side plating were studied for test plate with 23:1 high aspect ratio and outer line width and line distance of 4/4mil. Not only the process design of the three schemes is optimized, but also the process critical control points of the three schemes are discussed,and the experimental results are discussed and reliability is tested. Finally, the risk points of abnormal quality of the three schemes are analyzed, and the prevention and improvement suggestions are provided for some risk points.更多还原