【摘要】 随着终端电子产品不断朝着微型化、多功能、智能化的方向发展，高密度互连（HDI）印制电路板的应用越来越广泛。通孔电镀铜作为HDI板层间互连的关键技术，其镀铜性能一直是电镀铜研究的热点。本文采用多物理场耦合的有限元方法讨论了HDI板在不同镀液体系的通孔电镀铜过程，探讨了添加剂在电极表面的吸附作用及其对镀层的影响，获得了HDI板通孔电镀铜的“蝴蝶”状填充机制。这一结论为HDI板层间互连研究提供了一定的理论指导。更多还原

【Abstract】 With the continuous development of terminal electronic products to miniaturization, multifunctionality and intelligence, the application of HDI board is becoming increasingly widespread. Through-holes(THs) electroplated copper acts as a crucial technology for interlayer interconnection of HDI board. Performance of copper electroplating has always been a hot spot for the research of electroplated copper. Finite element method of multi-physics coupling was applied to discuss the process of THs copper electroplating in different plating solution systems. The adsorption effect of additives on the electrode surface and its impact on coating were investigated. A “butterfly” filling mechanism for THs copper electroplating was obtained. This conclusion provides certain theoretical guidance for the research of interlayer interconnection of HDI boards.更多还原