【摘要】 采用直接镀法和扫描电子显微镜研究了影响无氧铜线镀钯层质量的因素。结果表明：浸镀时间和纳米钯粉含量对无氧铜线镀钯层质量有显著影响。当镀液中纳米钯粉的质量分数为2%、表面活性剂OP-10的质量分数为3%时，在室温浸镀15 min以上的无氧铜线表面纳米钯颗粒团聚较少，几乎无露铜现象；纳米钯粉和OP-10的质量分数分别增加至4%和6%时，在室温浸镀20 min的无氧铜线镀层质量最好。此外，当镀液温度升高至约60℃时，浸镀15 min的无氧铜线镀层不均匀，漏铜现象明显。在450℃真空退火后，镀钯铜线的镀层界面结合强度和平整度提高。更多还原

【Abstract】 Direct plating method and scanning electron microscopy(SEM) was used to study the factors affecting the coating quality of palladium-plated oxygen-free copper wire. The results showed that the immersion time and the content of nano palladium powder had a significant impact on the coating quality of palladium-plated oxygen-free copper wire. The palladium-plated oxygen-free copper wire immersion plated for more than 15 min had almost no agglomeration of palladium nanoparticles and copper exposure when the mass fraction of nano palladium powder was 2% and the mass fraction of surfactant OP-10 was 3% in the plating solution; by increasing the mass fraction of nano palladium powder to 4% and OP-10 to 6% in the plating solution, the coating quality of oxygen-free copper wire immersion plated for 20 min at room temperature was the best. In addition, the oxygen-free copper wire immersion plated at about 60 ℃ for 15 min exhibited uneven coating and obvious copper exposure. The interface bonding strength and flatness of the palladium-plated copper wire coating after vacuum annealing at 450 ℃ were improved.更多还原