【摘要】 为提高覆铜板的导热性能，以SiO₂为主要填料，同时添加高导热Al₂O₃制备了环氧覆铜板，探究Al₂O₃的含量、粒径对覆铜板的导热、介电性能、剥离强度及击穿电压等性能的影响。结果表明，填料总填充质量分数为80%，其中SiO₂质量分数为80%,Al₂O₃质量分数为20%且5μm与10μm粒径的Al₂O₃质量比为1∶1时，制备的覆铜板的导热率为1.39 W/（m·K）,10 GHz下介电常数（D_k）为3.61，介电损耗（D_f）为0.01，击穿电压为7.02 kV（100μm），剥离强度为1.12 N/mm，达到高导热高速覆铜板的要求。更多还原

【Abstract】 Inorder to improve the themal conductivity of copper clad laminate,the epoxy copper clad plate were prepared by using SiO₂as the main filler and adding Al₂O₃ with high thermal conductivity.The effects of Al₂O₃content and particle size on the thermal conductivity,dielectric properties,peel strength,breakdown voltage,and other properties of the copper clad plate were explored.The results indicate d that when the total mass fraction of the filler was 80%,in which the mass fraction of SiO₂ was 80% and the mass fraction of Al₂O₃ was 20%,and the mass ratio of Al₂O₃ with 5μm and 10μm particle size was 1∶1,the thermal conductivity of the prepared copper clad plate was1.39 W/（m·K）.The dielectric constant（D_k）and dielectric loss tangent（D_f）was 3.61 and 0.01 at 10 GHz,resprctively.Additionally,the breakdown voltage was 7.02 kV（100μm）,and the peel strength was 1.12 N/mm.It met the requirements of high thermal conductivity and high speed copper clad plate.更多还原