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粉末状芳香族聚酰亚胺金属复合结合剂的制备研究
Preparation of powdered aromatic polyimide metal composite binder
【摘要】 为解决传统树脂结合剂耐热性不高及与低熔点金属温度匹配性差的问题,以2,2′-双[4-(4-氨基苯氧基)苯基]丙烷(BAPP)和均苯四甲酸酐(PMDA)为单体,通过两步合成法制备聚酰亚胺树脂(PI),通过调控反应参数发现加料顺序为先胺后酐,反应时间6 h,单体PMDA与BAPP物质的量比为1.02∶1时,PI分子质量最佳,具有较好的力学性能(纯PI结合剂弯曲强度达95 MPa)和热稳定性(初始分解温度约510℃)。其与低熔点铜合金制备复合结合剂时,具有较好的成型温度匹配性和耐热性,当树脂体积分数为10%时,PI及聚酰胺酸复合结合剂的弯曲强度分别为532 MPa和540 MPa,综合性能较佳。
【Abstract】 In order to solve the problems of low heat resistance and poor temperature matching with low melting point metals in traditional resin binders, polyimide resin(PI) was prepared by two-step synthesis method using 2,2′-bis [4-(4-aminophenoxy) phenyl]propane(BAPP)and phthalic anhydride(PMDA)as monomers. By adjusting the reaction parameters, it was found that the feeding order was amine followed by anhydride,and the reaction time was 6 h. When the molar ratio of monomer PMDA to BAPP was 1.02 ∶ 1,the molecular weight of PI was optimal. It had good mechanical properties(pure PI binder with a flexural strength of 95 MPa)and thermal stability(initial decomposition temperature of about 510 ℃). When preparing composite binders with low melting point copper alloys,it had good temperature matching and heat resistance. When the resin volume fraction was 10%,the flexural strength of PI and polyamide acid composite binder was 532 MPa and 540 MPa,respectively,with better comprehensive performance.
【Key words】 polyimide; high temperature resistance; composite binder; low melting point metal alloy; flexural strength; thermal stability;
- 【文献出处】 热固性树脂 ,Thermosetting Resin , 编辑部邮箱 ,2024年02期
- 【分类号】TG74
- 【下载频次】69