【摘要】 SiP堆叠封装技术已经逐渐用于高密度、高性能的集成电路封装中。以SiP堆叠封装为研究对象，对回流焊堆叠工艺中封装的翘曲进行了仿真分析，研究了不同塑封厚度和塑封材料热膨胀系数对封装翘曲的影响。结果表明，在回流焊升温阶段封装整体翘曲呈现上凸变形，在回流焊降温阶段封装整体翘曲呈现下凹变形，且回流焊降温阶段封装翘曲最大。塑封厚度的增加可以减小在回流焊过程中封装产生的翘曲，而塑封料热膨胀系数的增加则会使封装翘曲变得更为严重。因此通过增加塑封厚度以及减小塑封料的热膨胀系数均可以有效减小回流焊过程中SiP堆叠封装产生的翘曲。更多还原

【Abstract】 System-in-package(SiP) stacking technology has gradually been adopted in high-density and high-performance integrated circuit packaging. In this study, the warpage of packaging in a reflow soldering stack process was analyzed through simulation, focusing on SiP stack packaging. The influence of the encapsulation thicknesses and thermal expansion coefficients of different encapsulation materials on packaging warpage was investigated. Results showed that during the heating stage of reflow soldering, the overall packaging exhibited convex deformation, whereas during the cooling stage, it exhibited concave deformation, with the maximum warpage occurring in the cooling stage. Increasing the encapsulation thickness reduced the warpage generated during the reflow soldering process, whereas an increase in the thermal expansion coefficient of the encapsulation material resulted in more severe warpage. Therefore, warpage in SiP stack packaging during the reflow soldering process can be effectively mitigated by both increasing the encapsulation thickness and reducing the thermal expansion coefficient of the encapsulation material.更多还原