【摘要】 采用背散射电子衍射技术(EBSD)对无Cu与含Cu高硅无取向硅钢热处理过程的织构进行了检测，分析了微量Cu元素对高硅无取向硅钢织构的影响，并对其微观机理进行了探究。结果表明，在1000℃高温再结晶退火时，添加微量Cu元素对硅钢成品的织构起到明显的恶化作用；高温退火工艺可以更充分发挥剪切带优化织构的作用，但含微量Cu元素的无取向硅钢对剪切带优化织构有明显的抑制作用，其原因与基体中弥散析出的含Cu析出相有关。更多还原

【Abstract】 Effect of copper content on the texture of two high-silicon non-oriented silicon steels without Cu and with trace Cu was analyzed by EBSD technology, and the microscopic mechanism was also investigated. The results indicate that after high temperature annealing at 1000 ℃, the addition of trace Cu element has an obvious harmful effect on the texture of finished silicon steel product. The high temperature annealing process plays a more full role in optimizing the texture by the shear bands, while such optimizing effect is inhibited obviously by adding of trace Cu to the non-oriented silicon steel, which is attributed to the dispersive distribution of the copper precipitates in the steel matrix.更多还原