【摘要】 为研究周期性的温度变化对塑封器件铜键合处寿命的影响,选取塑封器件LM2902DGR4型运算放大器作为研究对象,研究其温度循环下的失效模式。基于Solidworks建模和ANSYS有限元仿真的方法,进行温度循环仿真,对仿真结果进行温度云图分析,最大主应力云图分析、等效应力云图分析和总变形云图分析。综合分析确定在温度循环条件下铜线键合处的失效模式为铜引线颈部的断裂,等效应力的变化范围为52.551～87.302MPa。基于Engelmaier模型,计算出其铜线键合部位在-40～125℃温度循环条件下的失效前循环次数为119901次。提出一种基于有限元仿真的铜线键合寿命研究方法,为该型号器件在实际工程应用时铜线键合处的寿命评估提供依据。更多还原

【Abstract】 To investigate the failure modes resulting from temperature cycling,the LM2902DGR4 encapsulated device,a type of operational amplifier,was selected as the research object. The temperature cycling simulation was conducted by using Solidworks modeling and ANSYS finite element simulation software. The simulation results were analyzed using temperature contour mapping,maximum principal stress contour mapping,equivalent stress contour mapping,and total deformation contour mapping. Comprehensive analysis reveals that the failure mode of the copper wire bond under temperature cycling conditions is a fracture at the copper lead neck,and the equivalent stress is from 52. 551MPa to 87. 302MPa. Using the Engelmaier model,the calculated pre-cycle failure count of the copper wire bond is 119901 cycles under temperatures cycle between -40℃ and 125℃. The lifespan predication method was proposed for the copper wire bonds using a finite element simulation method,which provides the basis for the lifespan assessment of this device in practical engineering applications.更多还原