【摘要】 射频系统级封装(SiP)的多物理场耦合分析问题已经成为限制其可靠性提升的关键因素。当前，射频SiP的多物理场耦合分析内容主要包括模型建立和数值算法，然而，模型建立方法以及算法的适用性与选择方法是一大难点。同时随着物理场和射频SiP模型复杂度的不断提高和计算需求的不断攀升，现有部分分析方法存在计算量大、适配不佳等问题亟待优化。本文对多物理场模型的建立方法及射频SiP关键物理场单场和耦合场方程进行了总结归纳，从方法特点和适用条件两个方面对有网格与无网格四种数值算法展开阐述，同时列举了若干种多物理场耦合优化方法，从建模、求解和耦合方式的角度为实现简化建模、加速计算、优化结果等目标提供了方法和建议，可以为射频SiP的多物理场耦合分析和改进工作提供参考。更多还原

【Abstract】 The multi-physical field coupling analysis problem of the RF-SiP has become a major factor limiting the reliability improvement. At present, the multi-physical field coupling analysis of the RF-SiP mainly includes model building and numerical algorithms, where the major difficulty is the applicability and selection method of model building method and algorithm. Meanwhile, due to increased complexity and computational demand of the physical field and RF-SiP models, some of the existing analytical methods need to be optimized to address the large amount of computation and poor adaptability problems. Therefore, this article reviews the multi-physical field modeling methods, the single and coupled field equations of the key physical fields of the RF-SiP, the four numerical algorithms with or without mesh from the characteristics and applicable conditions of these methods, and several multi-physical field coupling optimization methods. From the perspective of modeling, solving and coupling methods, this review paper also provides methods and suggestions for simplifying modeling, accelerating computation, and optimizing the results. The review paper can provide a reference for the analysis and improvement of multiphysics field coupling in the RF-SiP.更多还原