【摘要】 针对晶圆划刻中激光加工易产生重铸层且得到的沟槽深宽比小等问题，提出了兆声辅助激光加工方法，对激光烧蚀与兆声振动理论进行分析，并利用响应面分析法对加工参数进行优化。结果表明，兆声波能够将烧蚀产生的液相材料和熔融碎屑击出烧蚀区，从而减小重铸层面积，改善晶圆的表面形貌；附加兆声辅助后，沟槽划刻后晶圆表面重铸层面积减小约25%，烧蚀深宽比由2.65增加到3.82。基于上述研究，在晶圆表面划刻得到了形貌良好的网格结构，证明此方法能有效改善晶圆划刻的表面形貌，减少重铸层的产生，提高晶圆划刻的效率与精度。更多还原

【Abstract】 Facing the demand of wafer scribing,a megaacoustic assisted laser processing method was proposed to address the issues of easy generation of recast layers and low depth to width ratio of grooves. The theory of laser ablation and megaacoustic vibration was analyzed,and the response surface analysis method was used to optimize the processing parameters. The result showed that megasonic waves can knock out the liquid phase materials and molten debris generated by ablation from the ablation zone,thereby reducing the area of the recast layer and improving the surface morphology of the wafer. After adding megasound assistance,the area of the recast layer on the wafer surface decreased by25% after groove etching,and the ablation depth to width ratio increased from 2.65 to 3.82. Based on the above research,a well shaped grid structure was obtained by etching on the surface of the wafer,proving that this method can effectively improve the surface morphology of wafer etching,reduce the generation of recast layers,and improve the efficiency and accuracy of wafer etching.更多还原