【摘要】 具有解理面的晶圆解理时容易产生晶圆端面损伤，为了降低晶圆解理加工时的损伤，设计一套通过利用晶圆材料特性对晶圆进行解理加工的设备，降低了具有解理面材料晶圆解理加工时的端面损伤，实验结果表明通过该设备对具有解理面的晶圆解理加工可以获得无损伤、光滑的解理面。更多还原

【Abstract】 Wafers with cleavage surfaces are prone to damage at the wafer end face during cleavage. In order to reduce the damage during wafer cleavage,design a set of equipment for wafer cleavage processing by utilizing the characteristics of wafer materials,reducing the end face damage during wafer cleavage. The experimental results show that the device can obtain non-destructive,undamaged,and smooth cleavage surfaces during wafer cleavage processing.更多还原