【摘要】 热界面材料用于增强电子器件与散热器之间的热接触，其高热导率和良好的机械柔顺性能够在提高电子器件散热效率的同时，尽可能降低因热膨胀而产生的热应力。垂直排列的铜纳米线(CuNWs)阵列是一种兼顾高热导率和柔顺性的高性能热界面材料。本文基于相位敏感瞬态热反射方法探究了CuNWs阵列在热环境中的界面热传输性能。实验结果表明：CuNWs阵列与衬底之间的接触热导在热环境中保持稳定。数值模拟结果显示，CuNWs阵列的引入产生了低应力效应，能够抑制界面缺陷的产生和扩展；铜纳米线阵列可以有效调节热应力，从而增强了热界面的可靠性。更多还原

【Abstract】 Thermal interface materials are applied to enhance thermal contact between electronic devices and heat sinks.Its high thermal conductivity and good mechanical compliance can improve the heat dissipation efficiency of electronic devices while reducing thermal stress caused by thermal expansion at the same time.The vertically arranged copper nanowires(CuNWs) arrays are high-performance thermal interface materials which combine high thermal conductivity and compliance.The interface heat transfer performance of CuNWs arrays in thermal environment based on the phase sensitive transient thermal reflection method is investigated.The experimental results indicate that the contact thermal conductance between the CuNWs array and the substrate remains stable in thermal environment.The numerical simulation result shows that the introduction of CuNWs arrays produces low stress effect, which can suppress the generation and expansion of interface defects.This work indicates that CuNWs arrays can effectively regulate thermal stress, thus enhancing the reliability of thermal interfaces.更多还原