【摘要】 如何降低芯片结温成为大功率紫外LED应用的关键。本文提出了一种新型圆柱扰流水冷散热器，对光源模块进行高效热管理。采用COMSOL软件对散热系统进行热场和流场分析，分别从散热器盖板厚度、扰流柱直径、增加档板结构、流速设置四个方面进行优化仿真，有效改善流动均匀性、提高换热效果，将功率密度643 W/cm~2的串联紫外LED光源模块的芯片结温由120℃降至95℃。更多还原

【Abstract】 How to reduce the junction temperature of chip has become the key point to the application of high-power UV-LED module. This paper proposes a novel type of cylindrical spoiler water-cooled radiator to manage the light source module efficiently. The COMSOL software was used to analyze the thermal field and flow field of the heat dissipation system. The simulation was optimized from four aspects such as the thickness of the radiator cover plate, the diameter of the spoiler, the structure of the baffle plate and the setting of flow velocity, which effectively improved the flow uniformity and heat exchange. The junction temperature of the serial UV-LED chips is reduced from 120 ℃ to 95 ℃ at power density 643 W/cm~2.更多还原