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Impacts of hydrogen annealing on the carrier lifetimes in p-type 4H-SiC after thermal oxidation

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【作者】 张锐军洪荣墩韩景瑞丁雄杰李锡光蔡加法陈厦平傅德颐林鼎渠张明昆吴少雄张宇宁吴正云张峰

【Author】 Ruijun Zhang;Rongdun Hong;Jingrui Han;Hungkit Ting;Xiguang Li;Jiafa Cai;Xiaping Chen;Deyi Fu;Dingqu Lin;Mingkun Zhang;Shaoxiong Wu;Yuning Zhang;Zhengyun Wu;Feng Zhang;Department of physics, Xiamen university;Guangdong Tianyu Semiconductor Co., Ltd;

【通讯作者】 洪荣墩;张峰;

【机构】 Department of physics, Xiamen universityGuangdong Tianyu Semiconductor Co., Ltd

【摘要】 Thermal oxidation and hydrogen annealing were applied on a 100 μm thick Al-doped p-type 4H-Si C epitaxial wafer to modulate the minority carrier lifetime, which was investigated by microwave photoconductive decay(μ-PCD). The minority carrier lifetime decreased after each thermal oxidation. On the contrary, with the hydrogen annealing time increasing to3 hours, the minority carrier lifetime increased from 1.1 μs(as-grown) to 3.14 μs and then saturated after the annealing time reached 4 hours. The increase of surface roughness from 0.236 nm to 0.316 nm may also be one of the reasons for limiting the further improvement of the minority carrier lifetimes. Moreover, the whole wafer mappings of minority carrier lifetimes before and after hydrogen annealing were measured and discussed. The average minority carrier lifetime was up to 1.94 μs and non-uniformity of carrier lifetime reached 38% after 4-hour hydrogen annealing. The increasing minority carrier lifetimes could be attributed to the double mechanisms of excess carbon atoms diffusion caused by selective etching of Si atoms and passivation of deep-level defects by hydrogen atoms.

【Abstract】 Thermal oxidation and hydrogen annealing were applied on a 100 μm thick Al-doped p-type 4H-Si C epitaxial wafer to modulate the minority carrier lifetime, which was investigated by microwave photoconductive decay(μ-PCD). The minority carrier lifetime decreased after each thermal oxidation. On the contrary, with the hydrogen annealing time increasing to3 hours, the minority carrier lifetime increased from 1.1 μs(as-grown) to 3.14 μs and then saturated after the annealing time reached 4 hours. The increase of surface roughness from 0.236 nm to 0.316 nm may also be one of the reasons for limiting the further improvement of the minority carrier lifetimes. Moreover, the whole wafer mappings of minority carrier lifetimes before and after hydrogen annealing were measured and discussed. The average minority carrier lifetime was up to 1.94 μs and non-uniformity of carrier lifetime reached 38% after 4-hour hydrogen annealing. The increasing minority carrier lifetimes could be attributed to the double mechanisms of excess carbon atoms diffusion caused by selective etching of Si atoms and passivation of deep-level defects by hydrogen atoms.

【关键词】 4H-SiCcarrier lifetimehydrogen annealing
【Key words】 4H-SiCcarrier lifetimehydrogen annealing
【基金】 Project supported by Key Area Research and Development Project of Guangdong Province, China (Grant No. 2020B010170002);the Science Challenge Project (Grant No. TZ2018003-1-101);the Natural Science Foundation of Fujian Province of China for Distinguished Young Scholars (Grant No. 2020J06002);the Science and Technology Project of Fujian Province of China (Grant No. 2020I0001);the Fundamental Research Funds for the Central Universities (Grant Nos. 20720190049 and 20720190053);the Science and Technology Key Projects of Xiamen (Grant No. 3502ZCQ20191001);the National Natural Science Foundation of China (Grant No. 51871189)
  • 【文献出处】 Chinese Physics B ,中国物理B , 编辑部邮箱 ,2023年06期
  • 【分类号】TN304.24
  • 【下载频次】2
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