【摘要】 通过涂布法并结合铜箔棕化处理技术进行液晶聚合物（LCP）覆铜板层压制作，获得LCP覆铜板，其厚度误差较好地控制在10%以内。对LCP覆铜板的综合应用性能，如热稳定性、尺寸稳定性、高频应用特性等进行综合表征。结果表明：LCP覆铜板的玻璃化温度（T_g）达到了200℃；覆铜板经过如高温冲击、冷热冲击试验后，仍然具备较好的剥离强度和耐热性能；此外，高频D_k、D_f与插入损耗测试，证实了其在高频方面的应用优势，因此可成为挠性印制电路板领域重要的电子材料。更多还原

【Abstract】 In this paper, the fabrication of LCP CCL was studied by coating method. Its application properties of LCP copper clad laminate such as thermal stability, dimensional stability and high frequency application characteristics were comprehensively characterized. Results suggested that LCP CCL has good thermal, mechanical and high-frequency application properties, and is an important electronic material in the field of flexible printed circuit boards in the future.更多还原