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微悬臂梁传感系统在Au-半导体复合纳米材料微热量检测中的应用

Application of Microcantilever Sensing System in Micro Heat Detection of Au-semiconductor Composite Nano Materials

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【作者】 滕艳华王启明周宁鸿冯贺许艺婷刘松薛长国

【Author】 TENG Yan-hua;WANG Qi-ming;ZHOU Ning-hong;FENG He;XU Yi-ting;LIU Song;XUE Chang-guo;School of Materials Science and Engineering, Anhui University of Science and Technology;

【通讯作者】 薛长国;

【机构】 安徽理工大学材料科学与工程学院

【摘要】 文中采用一种基于微悬臂梁传感器的检测系统,实现了对Au-半导体复合纳米材料的微热量检测。根据光杠杆检测的方法研究了Au-半导体复合纳米材料光热转换散发热量对微悬臂梁挠度的影响。为验证系统对此类材料微热量检测的适用性,实验选用了已知在530 nm处光热吸收峰的Au-ZnO粉末样品材料,分别取多组不同质量的样品材料进行检测,通过最小二乘法拟合出温度变化与微悬臂梁偏移量之间的关系。结果显示:温度变化与微悬臂梁偏移量呈线性关系,且0.1 mm~2面积的样品薄膜拟合曲线的线性相关系数为0.996 1。比较温度检测值与实验系统的拟合值,结果基本一致,验证了系统的可靠性。

【Abstract】 A detection system based on a microcantilever sensor was used to realize the micro-heat detection of Au-semiconductor composite nanomaterials. Based on the method of optical lever detection, the system studied the effect of the heat emitted by the photothermal conversion of Au-semiconductor composite nanomaterials on the deflection of the microcantilever. In order to verify the applicability of the system to the microcalorie detection of such materials, the Au-ZnO powder sample material with a known photothermal absorption peak at 530 nm was selected in the experiment, and several groups of sample materials of different quality were selected for detection. The relationship between the temperature variation and the offset of the microcantilever beam was fitted by the least square method. The results show that the temperature change has a linear relationship with the offset of the microcantilever, and the linear correlation coefficient of the fitting curve of the sample film in the area of 0.1 mm~2 is 0.9961. By comparing the temperature detection value with the fitting value of the experimental system, the results are basically consistent, which verifies the reliability of the system.

【基金】 国家自然科学基金项目(11872001,12172002);安徽省自然科学杰出青年科学基金项目(1808085J30);安徽省重点研究与开发计划项目(202004h07020026);安徽省留学回国人员创新项目
  • 【文献出处】 仪表技术与传感器 ,Instrument Technique and Sensor , 编辑部邮箱 ,2023年02期
  • 【分类号】TB383.1;TP212
  • 【下载频次】16
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