【摘要】 太赫兹调频连续波成像技术具有高功率、小型化、低成本、三维成像等特点，在太赫兹无损检测领域受到了广泛关注。然而由于微波及太赫兹器件限制，太赫兹信号带宽难以做大，从而制约了成像的距离向分辨力。虽然高载频可实现较大宽带，但伴随的低穿透性和低功率会限制太赫兹调频连续波成像系统的应用场景。因此，聚焦于太赫兹波无损检测领域，提出一种时分频分复用的114～500 GHz超宽带太赫兹信号的产生方式，基于多频段共孔径准光设计，实现超带宽信号的共孔径，频率可扩展至1.1 THz。提出一种频段融合算法，实现了超宽带信号的有效融合，距离分辨力提升至460μm，通过人工设计的多层复合材料验证了系统及算法的有效性，并得到封装集成电路(IC)芯片的高分辨三维成像结果。更多还原

【Abstract】 Terahertz Frequency Modulated Continuous Wave(THz FMCW) imaging technology has attracted extensive attention in the field of THz Nondestructive Testing(NDT) because of its high power,miniaturization, low cost, three-dimensional imaging and other characteristics. However, due to the limitation of microwave and terahertz devices, the terahertz signal bandwidth is difficult to expand, which restricts the range resolution of imaging. Although high carrier frequency can achieve large broadband,the accompanying low penetrability and low power will limit the application scenario of THz FMCW imaging system. Therefore, focusing on the field of terahertz wave nondestructive testing, this paper proposes a time-division frequency-division multiplexing 114～500 GHz ultra-wideband terahertz signal generation method, which is based on the quasi-optical design of multiband common aperture to achieve the common aperture of ultra-wideband signals. In addition, a multiband fusion algorithm is proposed to achieve effective fusion of ultra-wideband signals, and the range resolution is improved to 460 μm. The effectiveness of the system and algorithm is verified by artificially designed multilayer composite materials, and the high-resolution 3D imaging results of Integrated Circuit(IC) chips are obtained.更多还原