【摘要】 面对日益严峻的技术封锁及遏制风险，深入技术本身，掌握技术系统内部关键组件、工艺以及方法等技术要素是突破技术瓶颈的关键环节。归纳关键技术要素的3个特征——关键性、创新性以及基础性。以高速芯片为例，利用专利文献数据，分析高速芯片专业术语。引入SAO(Subject-Action-Object)语义结构，提取高速芯片技术要素，以技术要素为节点、技术要素关联强度为边，构建高速芯片SAO语义网络。借鉴社会网络分析方法，量化技术要素权利、地位以及创新力，识别高速芯片系统内关键技术要素，探究高速芯片技术结构，寻找技术卡点。实证结果显示，高速芯片“卡脖子”技术中存在“高速数据”“单片微机”“fpga芯片”“晶圆”4个关键技术要素。更多还原

【Abstract】 Facing the growing risk of technological embargoes and containment, digging deeper into the key core technology information and mastering the key technology elements within the technology system, such as key components, processes, and methods, is the premise of breaking through the technology bottleneck. The three characteristics of key technology elements are summarized as critical, innovative, and fundamental. This research takes the high-speed chip as an example, adopts patent literature data, and analyzes terminologies for high-speed chips. We introduce SAO(Subject-Action-Object) semantic structure, extract high-speed chip technology elements, and take technology elements as nodes and technology element association strength as edges to construct high-speed chip SAO semantic network. Afterwards, we draw on social network analysis methods, quantify technology element rights, status, and innovation capability, identify key technology elements inside high-speed chip system, explore high-speed chip technology structure, and find technology chokepoints. The research results show that there are four key technology elements of stranglehold on technology: “high-speed data”, “single-chip microcomputer”, “fpga chip”,and “wafer”.更多还原