【摘要】 通过分析文献电镀体系，发现在一些混配配合物电镀体系中其放电混配配离子分布系数取最大值.由于实际工作使用的放电混配配离子分布系数峰大多顶部有一定的宽度，这类混配配合物电镀体系对电镀工艺条件，如pH值、温度等的变化具有一定的缓冲作用，能有利于保持电镀过程电流密度恒定，即有利于开发成稳定的电镀体系.同时还发现在一些合金电镀体系中，不同金属的放电配离子分布系数均取其最大值，即合金电镀体系中自由配体浓度范围是不同金属放电配离子单独电镀时自由配体浓度区间的交集.研究有利于进一步揭示电镀溶液组成规律，并可能将来有利于减少实际工作中配方实验的工作量.更多还原

【Abstract】 The distribution coefficients of discharge complex ions were found to reach their maximums in some mixed-ligand complex plating systems we studied.Because the mixed-ligand complexes used in plating system normally have a broad peak of their distribution coefficient curves, we think that above plating systems can have buffering effects on variations of pH,temperature and other parameters, can also help to keep current density constant in plating process, and similar mixed-ligand complexes can be used to develop stable plating systems.At the same time, we also found that the distribution coefficient of every individual discharge complex ion also reaches their maximums in some alloy plating systems, it means that in each above plating system, the concentration range of every individual free ligand in alloy plating system is the intersection of these in their each single metal plating system.Our study might be helpful to further understanding the nature of plating solution composition, and also might be helpful to reduce workload of formulation optimization experiments in future work.更多还原