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黑曲霉与泡盛曲霉固态共发酵麦麸的工艺优化
Optimization of Solid State Co-fermentation of Wheat Bran with Aspergillus niger and Aspergillus awamori
【摘要】 为提高黑曲霉与泡盛曲霉固态共发酵麦麸释放酚类活性物质的能力,以培养基总酚含量为评价发酵效果的指标,应用Plackett-Burman实验设计与响应面分析法优化共发酵条件,通过光吸收法测定酚类产物的DPPH自由基清除率及总还原能力。实验结果表明,黑曲霉与泡盛曲霉固态共发酵麦麸的最佳工艺参数为:麦麸10.0 g、(NH4)2SO4含量17.0 mg/g麦麸、KH2PO4含量1.8 mg/g麦麸、含水量79.05%、黑曲霉与泡盛曲霉接种比例1∶2、接种量为1.1 mL(约1×107个孢子/mL)、发酵温度29℃、发酵时间6 d。此条件下,发酵产物总酚含量达到2 498.34 μg/g,比优化前提高了37.32%。发酵产物的DPPH自由基清除率、总还原力较优化前亦显著提高(P<0.05)。该工艺优化既提高麦麸释放酚类含量,又增强了产物的抗氧化能力,为麦麸的充分利用提供了实验依据。
【Abstract】 In order to improve the release of phenolic compounds from wheat bran by solid co-fermentation of Aspergillus niger and Aspergillus awamori, the Plackett-Burman experiment design and response surface analysis were used to optimize the co-fermentation conditions, taking the total phenolic content of the medium as the evaluation index. The DPPH radical scavenging rate and total reducing ability of phenolic products were determined by photoabsorption method. The optimal parameters of solid state co-fermentation with Aspergillus niger and Aspergillus awamori are 10.0 g wheat bran,(NH4)2SO4 content 17.0 mg/g wheat bran, KH2PO4 content 1.8 mg/g wheat bran, water content 79.05%, inoculation ratio of Aspergillus niger and Aspergillus awamori 1∶2 and inoculation amount 1.1 mL(about 1×107 spores/mL) at 29 ℃ for 5 days. Under these conditions, the content of total phenolic product reaches 2 498.34 μg/g, which is 37.32% higher than that before optimization. The DPPH radical scavenging rate and total reducing power are also significantly higher than before(P<0.05). The process optimization can not only increase the phenols production of wheat bran fermentation, but also enhance the antioxidant capacity of the products, which provides an experimental basis for the full utilization of wheat bran.
【Key words】 solid state co-fermentation; Aspergillus niger; Aspergillus awamori; response surface method; oxidation resistance;
- 【文献出处】 青岛大学学报(自然科学版) ,Journal of Qingdao University(Natural Science Edition) , 编辑部邮箱 ,2023年02期
- 【分类号】TS210.9
- 【下载频次】59