【摘要】 三维异构集成(3D Heterogeneous Integration, 3DHI)是美国国防高级研究计划局(DARPA)电子复兴计划(ERI)中持续聚焦发展的重点领域之一。分析ERI项目中有关射频三维异构集成技术的研究进展，剖析典型射频微系统创新应用案例，解析新技术应用转化动态及技术路线图。面向军事电子装备对射频系统微型化、多功能、可重构、高性能需求的挑战，梳理ERI 2.0在三维异构集成研究领域的进一步发展思路及新项目布局，提出ERI对射频微系统集成技术发展的借鉴与启示意义。更多还原

【Abstract】 3D Heterogeneous Integration(3DHI) is one of the priority technology areas of the Electronic Renaissance Initiative(ERI) of the U.S. Defense Advanced Research Projects Agency(DARPA). Analysis of the technical progresses within ERI programs related to RF 3D Heterogeneous Integration, profiling of typical innovative RF microsystem application cases, and insight into state-of-the-art technology leveraging trends and the roadmap. To meet the challenges of miniaturization, multi-function, reconfigurability, and high performance of RF systems for military electronic equipment, the further development concepts and new programs of ERI 2.0 in the field of 3D heterogeneous integration are described, and the implications of the ERI for the development of RF microsystem integration technologies are proposed.更多还原